亞太優勢利用完整先進的微機電製程模組，做為製程平台的建構基礎，並已經成功在矽晶圓、玻璃、SOI及Cavity SOI 等不同基材上，建立許多標準製程平台。這些製程平台將加速客戶的微機電元件設計驗證，並縮短其產品市場銷售的準備時間。亞太優勢持續加強拓展在微機電製程模組種類，並將其順利整合。同時，我們也可以開發特別的製程流程，來符合客戶的特別需求。
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>> SOI / Cavity SOI / SOG 晶片製程平臺
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- Typical SOI Process with Notch Control
- Vertical Step Comb Structure
- High Aspect Ratio and Verticality
- Silicon-on-glass with Bonding and Thinning Process
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>> 晶片封裝製程平臺
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- Low Temperature Adhesive Bonding
- Au/Sn, Ge/Al Eutectic Bonding for Hermetic Seal
- Special Dicing Technology for Encapsulated Dice
- Customized Encapsulation
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>> CMOS 整合製程平臺
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- 5v/12v/18v NMOS Capability for Monolithic Smart MEMS
- Low Temperature Deposition on CMOS Wafers
- DRIE on CMOS Wafers
- CMOS/MEMS Wafer Bonding
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>> 面型加工製程平臺
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- Low stress Poly-Si and SiNx Films
- Lift-off Process
- Shadow Mask Process
- Piezoresistive Sensing Element
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>> 體型加工製程平臺
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- Anisotropic (KOH & TMAH) Silicon Etching
- High-aspect-ratio Si Structure
- Double Side Pattern Alignment
- RIE of Poly-Si, SiN, SiO2, TaN, Ta2O5, and Metals
- Through Wafer Interconnection
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