回首頁 網站導覽 聯絡我們 ENGLISH

您的微機電晶圓製造夥伴,提供微機電元件的快速初期驗證到大量生產的服務。

亞太優勢提供客戶微機電元件製造服務,包含了微機電製程、晶圓級封裝
、特殊切割與晶圓級測試。客戶可以使用亞太優勢開發的製程模組與製程平台,快速組合完成製程驗證與量產製造,也可以提出特殊需求進行客製化的製造服務。結合豐富的微機電產品知識與經驗,亞太優勢除了微機電製程外,同時能協助客戶進行設計改善與最佳化。運用了半導體的製造環境與紀律,亞太優勢的產出已達到每月一萬片以上的六吋晶圓,其中包含了壓力計、加速度計、陀螺儀、微機電掃描鏡、微機械結構與其它微機電元件。這些微機電產品已被廣泛應用在消費性電子、汽車產業、工業應用
、通信產業與生醫產業等領域。


 
回首頁晶圓代工製程能力

製程能力

成立初期,亞太優勢由原CMOS製程晶圓廠,轉變為一自動化六吋微機電晶圓代工廠。除保留原本半導體業之生產系統與紀律,並增加多種微機電製程能力。不僅專注於提升量產之生產效率,我們也調適並建立多樣靈活之微機電製程。在所建立的微機電製程模組與準則中,亞太優勢已熟悉並成熟運用,如Au、Pt、polyimide 與晶圓雙面製程等常見之微機電製程材料。目前,亞太優勢擁有每月超過一萬片的生產能力,與多種先進的微機電設備機台,例如高深寬比反應離子蝕刻機與晶圓鍵結機台。亞太優勢將持續投資,並發展新穎尖端的微機電製程能力,與增加生產產能。
 
 薄膜製程
 
>> 金屬薄膜

  • Sputtering: AlCu, Ta, Ta2O5, Ti, TiN, Au, TaAl, Cr, NiCr, with pre-sputter etching
  • E-Gun Deposition: Ti, Au, Pt, Ni, Ag, Cr, Al
  • Other spec per Customer request
  • Metals: nominal thickness from 50 Angstroms to 2 µm
 
 
>> 非金屬薄膜

  • PECVD: SiN; SiO2; SiC, PSG, BPSG
  • Furnace: SiN, SiO2; Poly-Si
  • LPCVD diffusion tube furnace: Nitride; Poly; Doped Poly
  • Thermal oxidation and annealing furnaces
  • Other spec per Customer request
  • Dielectrics: nominal thickness from 100 Angstrom to 30 µm
 
>> 離子植入 / 熱處理

  • Hi current Implanter: up to 160 kev, dose 1014 -1016 /cm2, species: P, B, BF2, As
  • Medium current Implanter: up to 160 kev, dose 1012 -1014 /cm2, species: P, B, BF2, As
  • Annealing, Alloy, RTP
 
--------------------------------------------------------------------------------------------------------------------------------------------------------------
 黃光製程
 
>> 步進機 / 對準機

  • 5X G-line Stepper: 1 µm resolution; registration < 0.2 µm
  • 1X Double Side Aligner: 3 µm resolution; registration < 2 µm
  • 2.0 µm resolution for single side exposure & 5.0 µm resolution for double side exposure
  • Double side aligner and exposure
  • 2.0 µm overlay control for single side alignment & 4.0 µm overlay control for double side alignment 

 

 
>> 塗附機 / 顯影機

  • Coater Track
  • Double Side Coater / Developer system
  • Spray Coater
  • Developer Track
 
--------------------------------------------------------------------------------------------------------------------------------------------------------------
 蝕刻製程
 
>> 乾式蝕刻

  • Metal Etcher
  • Poly Si Etcher
  • ICP deep Si Etcher
  • Oxide / SiNx Etcher
 
>> 濕式蝕刻
 

  • Wafer Cleaning Bench
  • PR Stripper
  • Metal / Oxide / SiNx Etcher
  • Metal Lift-off
  • KOH Etcher with ECE Stop
  • Scrubber for Particle Removal
 
--------------------------------------------------------------------------------------------------------------------------------------------------------------
 晶圓鍵結
 
>> Anodic Bond

  • Wafer/Substrate Configuration: Any combination of Silicon and Glass
  • Wafer/Substrate Parameter: Diameter: 150mm ; Thickness: up to 4mm
  • Heater: Up to 550°C ; Uniformity: 1% at 250°C
  • Contact Force: Up to 40K Newton ; Homogeneity: ±5%
  • Pressure Chamber: Vacuum to 1x10-3 mbar ;Over Pressure to 2bar
 
>> Other Bond

  • Fusion Bond
  • Adhesive Bond
  • Eutectic Bond with Forming Gas
  • Bond Align Accuracy ± 3µm 
 
--------------------------------------------------------------------------------------------------------------------------------------------------------------
 量測分析
 
>> Thickness / CD / Inspection

  • KLA Tencor M-Gauge 300 Al Thickness Meter
  • Hitachi 8620 CD SEM
  • KLA Tencor Surfscan 7700M, 4500
  • Tenco Alpha-Step 200
  • Veeco 3D Profiler NT8000
  • Leica INS 3000
  • Nanometrics 8000X, 800XE
  • Toray Automatic Inspection
 
>> Stress / RS / Other

  • SMSi 8900 TC Stress Probe 500
  • FLX2320S Stress Meter
  • Four Dimensions 280 C Rs Meter
  • Prometrix RS35e RS Meter
  • MDC CSM/2 CV Plotter
  • BIO-RAD QS 300 FTIR
  • Therma-Wave Therma Probe 500
  • Thermo Scientific FT-IR
 
--------------------------------------------------------------------------------------------------------------------------------------------------------------
 切割與測試
 
>> 切割

  • Clean room: 500 sq.m (5,400 sq. ft)
  • Class 5000
  • Installed with standard and customized tools for MEMS products function test and dicing; including die mount, wire bond, and pressurized testing
 
>> 測試

  • TEL P8 test probe
  • EG200 CP testing equipment
  • TSK APM-90A CP testing equipment
 

關於亞太優勢晶圓代工品質管理最新消息人力資源聯絡我們 造訪人次: 00964648 人次
版權所有 © 2010 亞太優勢微系統股份有限公司 聯絡電話: +886-3-666-1188 電子郵件: sales@apmsinc.com

公司地址:新竹科學工業園區研發六路2號