成立初期，亞太優勢由原CMOS製程晶圓廠，轉變為一自動化六吋微機電晶圓代工廠。除保留原本半導體業之生產系統與紀律，並增加多種微機電製程能力。不僅專注於提升量產之生產效率，我們也調適並建立多樣靈活之微機電製程。在所建立的微機電製程模組與準則中，亞太優勢已熟悉並成熟運用，如Au、Pt、polyimide 與晶圓雙面製程等常見之微機電製程材料。目前，亞太優勢擁有每月超過一萬片的生產能力，與多種先進的微機電設備機台，例如高深寬比反應離子蝕刻機與晶圓鍵結機台。亞太優勢將持續投資，並發展新穎尖端的微機電製程能力，與增加生產產能。
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.gif) 薄膜製程 |
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>> 金屬薄膜
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- Sputtering: AlCu, Ta, Ta2O5, Ti, TiN, Au, TaAl, Cr, NiCr, with pre-sputter etching
- E-Gun Deposition: Ti, Au, Pt, Ni, Ag, Cr, Al
- Other spec per Customer request
- Metals: nominal thickness from 50 Angstroms to 2 µm
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>> 非金屬薄膜
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- PECVD: SiN; SiO2; SiC, PSG, BPSG
- Furnace: SiN, SiO2; Poly-Si
- LPCVD diffusion tube furnace: Nitride; Poly; Doped Poly
- Thermal oxidation and annealing furnaces
- Other spec per Customer request
- Dielectrics: nominal thickness from 100 Angstrom to 30 µm
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>> 離子植入 / 熱處理
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- Hi current Implanter: up to 160 kev, dose 1014 -1016 /cm2, species: P, B, BF2, As
- Medium current Implanter: up to 160 kev, dose 1012 -1014 /cm2, species: P, B, BF2, As
- Annealing, Alloy, RTP
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黃光製程
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>> 步進機 / 對準機
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- 5X G-line Stepper: 1 µm resolution; registration < 0.2 µm
- 1X Double Side Aligner: 3 µm resolution; registration < 2 µm
- 2.0 µm resolution for single side exposure & 5.0 µm resolution for double side exposure
- Double side aligner and exposure
- 2.0 µm overlay control for single side alignment & 4.0 µm overlay control for double side alignment
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>> 塗附機 / 顯影機
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- Coater Track
- Double Side Coater / Developer system
- Spray Coater
- Developer Track
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蝕刻製程
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>> 乾式蝕刻
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- Metal Etcher
- Poly Si Etcher
- ICP deep Si Etcher
- Oxide / SiNx Etcher
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>> 濕式蝕刻
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- Wafer Cleaning Bench
- PR Stripper
- Metal / Oxide / SiNx Etcher
- Metal Lift-off
- KOH Etcher with ECE Stop
- Scrubber for Particle Removal
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晶圓鍵結
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>> Anodic Bond
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- Wafer/Substrate Configuration: Any combination of Silicon and Glass
- Wafer/Substrate Parameter: Diameter: 150mm ; Thickness: up to 4mm
- Heater: Up to 550°C ; Uniformity: 1% at 250°C
- Contact Force: Up to 40K Newton ; Homogeneity: ±5%
- Pressure Chamber: Vacuum to 1x10-3 mbar ;Over Pressure to 2bar
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>> Other Bond
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- Fusion Bond
- Adhesive Bond
- Eutectic Bond with Forming Gas
- Bond Align Accuracy ± 3µm
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量測分析
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>> Thickness / CD / Inspection
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- KLA Tencor M-Gauge 300 Al Thickness Meter
- Hitachi 8620 CD SEM
- KLA Tencor Surfscan 7700M, 4500
- Tenco Alpha-Step 200
- Veeco 3D Profiler NT8000
- Leica INS 3000
- Nanometrics 8000X, 800XE
- Toray Automatic Inspection
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>> Stress / RS / Other
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- SMSi 8900 TC Stress Probe 500
- FLX2320S Stress Meter
- Four Dimensions 280 C Rs Meter
- Prometrix RS35e RS Meter
- MDC CSM/2 CV Plotter
- BIO-RAD QS 300 FTIR
- Therma-Wave Therma Probe 500
- Thermo Scientific FT-IR
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切割與測試
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>> 切割
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- Clean room: 500 sq.m (5,400 sq. ft)
- Class 5000
- Installed with standard and customized tools for MEMS products function test and dicing; including die mount, wire bond, and pressurized testing
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>> 測試
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- TEL P8 test probe
- EG200 CP testing equipment
- TSK APM-90A CP testing equipment
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