Facility: (Wafer FAB)

FAB1: (6ˇ¨wafer--front end wafer process)

• Clean room: 2500 sq. m (27,000 sq. ft)
  
• Class 10/100
  
• Temperature Control
  
• Humidity Control

FAB2: (6ˇ¨wafer--front end wafer process)

• Clean room: 1400 sq. m (15,000 sq. ft)
  
• Class 10/100
  
• Temperature Control
  
• Humidity Control

Facility: (Bulk Etch Facility)

FAB1: (6ˇ¨ wafer--KOH and DHF, PHF)

• Clean room: 200 sq. m (10,000 sq. ft)
  
• Class 100
  
• Temperature Control
  
• Humidity Control

Facility: (Packaging)

Packaging Area:

• Clean room: 500 sq. m ( 5,400 sq. ft)
  
• Class 5000
  
• Temperature Control
  
• Humidity Control