SOI process platform, for example, has long been extensively recognized advantageous to many MEMS devices both on performance and manufacturability. In response to this increasing demand for SOI MEMS, a great deal of APM’s internal resources has been placed into the area in order to bring varieties to SOI platform. APM has accumulated extensive process experiences on making complex structures on the SOI of very thin to thick device layer, multiple device layers, or the one with embedded cavities. Fine combs and flexures, two-step structures, multistep well-aligned structures have been achieved in APM and qualified by numerous customers. Today, the SOI platform is being expanded into the Silicon-on-Glass process platform, which makes this platform more considerate for different customer requirements.

Temporary wafer bonding and debonding are the other technologies under development in APM. They are considered to greatly enhance the flexibility of manufacturing sequences, and allow handling thin wafers through processes. APM also see their huge potential in wafer packaging technology. Other techniques that catch our eyes are, for example, dry release and monolayer coating. They play a grate role when talking about device reliability. APM prioritizes these techniques in the roadmap while working closely with customers on their needs.  

APM believes it can stand out in the MEMS manufacturing competition through proactive mindset and rigorous production discipline on customers’needs, and, as a result, assists them in staying competitive in their MEMS product races.