製程能力

黃光製程

  • Stepper 5:1
    • G-line
    • Alignment accuracy: 0.2 µm
    • Minimum feature: 1 µm
    • Overlay
  • Contact aligner 1:1
    • Minimum feature: 3 µm
    • Alignment accuracy: 2 µm (front side align) & 4 µm (front to back side align)
  • Spray coating
  • Lift-off
  • Special materials: polyimide, BCB, SU8, protek, black PR

 

    

 

 

晶圓鍵結

  • Fusion bonding with or without cavities Si substrate.
  • Au/Sn, Ge/Al eutectic bonding with forming gas
  • Anodic bond for silicon or SOI on glass wafers
  • Adhesive bond
  • Bond alignment accuracy ± 5µm
  • Bonding in a controlled environment.
    • pressure range: 1x10-3 mbar in vacuum ~ 2 bar in over pressure
    • With heater and contact force capability (Max. 40KN)

 

    

 

 
 
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