黃光製程

• Stepper 5:1​
  • G-line
  • Minimum feature: 1 µm
  • Alignment accuracy: 0.2 µm
  • Overlay
• Contact aligner 1:1
  • Minimum feature: 3 µm
  • Alignment accuracy: 2 µm (front side align) & 4 µm (front to back side align)
• Spray coating
• Lift-off
• Special materials: polyimide, BCB, SU8, PBO, LOR, black PR

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晶圓鍵結

• Fusion bonding with or without cavities Si substrate.
• Au/Sn, Ge/Al eutectic bonding with forming gas
• Anodic bond for silicon or SOI on glass wafers
• Adhesive bond

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• Bond alignment accuracy ± 5µm
• Bonding in a controlled environment.
  • Pressure range: 1X10^-3 mbar in vacuum ~ 2 bar in over pressure
  • With heater and contact force capability (Max. 40KN)

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