製程能力

後段製程與測試

 

後段製程

  • Automated Dicing
  • Wafer Grinding
  • Die Mount
  • Wire Bond
  • Automated Optical Inspection (AOI)

    

 


 


 

 

測試 Test

  • Automated Probing
  • Electrical Parametric Testing
  • Standard and Customized Tools for MEMS Product Function Test

 

 
 
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