Process Capability

Thin Film & Diffusion Process

Thin Film/Diffusion Process

Metallization 

  • Sputter Deposition: AlCu, Cu, Pt, Ta, Ta2O5, Ti, TiN, Au, TaAl, Cr, NiCr, Ni
  • Evaporation: Ti, Au, Cu, Pt, Ni, Ag, Cr, Al
  • Electroplating: Cu

Plasma Thin Film Process Deposition

  • PECVD Oxide
  • PECVD Nitride
  • PECVD Amorphous Silicon
  • PECVD Silicon Carbide
  • PECVD PSG/BPSG

Furnace Process

  • Thermal Oxidation (900-1050ºC)
  • LPCVD Nitride (Standard, Low stress)
  • LPCVD Poly-Silicon
  • Annealing 
  • Metal Alloy
  • RTP

Ion Implantation 

  • Medium Current: (Energy: ~ 160 keV, Dosage: 1012-1014 )
  • High Current: (Energy: ~ 250 keV, Dosage: 1014-1016 )
  • Species: B, BF2, P, As

 

             

 

     

 
 
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