New State-of-the-art DRIE Etcher Added to APM Production Line
Release Date：29 November 2011 | Data Source：
APM is glad to announce that, in order to provide the first class foundry services to its customers, it has integrated a new state-of-the-art DRIE equipment, Pegasus DSi from SPTS, to its production line.
Today, DRIE (deep reactive ion etching) has been widely used in the fabrication processes of various MEMS (micro-electro-mechanical systems) devices. APM is glad to announce that, in order to provide the first class foundry services to its customers, it has integrated a new state-of-the-art DRIE equipment, Pegasus DSi from SPTS, to its production line.
High aspect ratio silicon etch has already been recognized as one crucial process in many applications nowadays. Mainstream consumer MEMS products, such as microphones and inertial sensors, and TSV (through silicon via) technology for 3D IC are examples with demanding DRIE etch performance. APM foresees customers’ requirements from both research and manufacturing perspectives, and keeps investing in leading edge technology and capacity.
Pegasus DSi upgrades APM’s dry etching capability with higher throughput volume and better production quality. This new addition has brought in the abilities such as fast etching rate with low tilt and high uniformity with large open ratio. APM currently can support customers with the higher quality on dry etching service, and correspondingly enhance the competitiveness of their MEMS products. Through continuous investment in technology, APM strives for better performance, fast time-to-market, and higher quality to achieve a win-win and grow with customers.
