Technologies

With our complete MEMS advanced process modules as building blocks, multiple process platforms have been built for the fabrication of MEMS devices on Si, Glass, SOI and cavity SOI substrates. These process platforms expedite the fabrication iterations for customer's design validation and the product time-to-market. APM continues on deepening and widening its platform categories, and smooth the integration between them. Meanwhile, we tailor process flows in order to meet customer's special requirements.

Substrate Technology

• Cavity SOI / Layer Transfer Technology

• SOG (Silicon on Glass) / Structured Glass and Glass Wafer Process

• Trench Isolation Technology

• Thin Wafer Handling (~200um)

Process Technology

• DRIE Step Comb / Step Deep Etch

• Nano Tip Process

• Fine Pattern on 3D Structures

Wafer Level Bonding

• Fusion Bond (Si-Si, Si-SiO2, SiO2-SiO2)

• Anodic Bonding (Including SGS / GSG Sandwich Bonding) 

• Low Temperature Adhesive Bonding

• Eutectic Bonding for Hermetic Seal 

• Capping with Lateral Feed Through and Special Dicing (Pad Reveal)