製程機台總覽
Capability
Wafer Size
150mm
200mm
Photolithography
Coater (Track)
Y
Furnace
Thermal oxidation
Coater
(Double side handling)
Anneal
Coater (Spray)
Alloy
Developer (Track)
LPCVD
Polysilicon
Developer
Silicon nitride
Stepper
Ion Implanter
Medium current
Aligner
High current
Bonding
Bonder
Grinding
Coarse grinding
Dry Etching
Si DRIE
Fine grinding
Ultra-fine grinding
Dielectric
Blade Dicing
Silcion dicing
Metal
Glass dicing
Glass DRIE
Laser Dicing
Stealth laser dicing (silicon)
Wet Etching
Wafer clean
Pick&Place
Si
WAT / CP test
Prober
Silicon oxide
Manual station
Metrology
CD SEM
Ellipsometer / Nanospec
Lift-off
Stress meter
PR strip
Surface profiler
Sputter
Metal sputter
3D profiler
Reactive sputter
IR microscope
Evaporator
White-light interferometer
Electroplating
Cu plating
PECVD
Amorphous silicon
Silicon carbide
PSG
BPSG