製程能力

後段製程與測試

 

後段製程

 

  • Automated Blade Dicing
  • Stealth Laser Dicing
  • Wafer Grinding
  • Automated Optical Inspection (AOI)

     

 

 

測試

 

  • Automated Probing
  • Electrical Parametric Testing
  • Standard and Customized Tools for MEMS Product Function Test

 

 

 
 
回上頁
˄