MEMS Express: Process Platforms




  • Layout design comes from customer.

  • Fixed process (film stacking and thickness) but adjustable poly sheet resistance.

  • 1P2M and 2P2M with backside release

  • Large suspended diaphragm, over 1.0 mm2 

  • Better efficiency with an additional black absorber layer

  • Cumulative Shipments: Over 14,000 wafers






For further information, please feel free to contact us via the following email address.