Technologies

The abundant MEMS advanced process modules (also known as building blocks) form the foundation of our wafer processing service and can be utilized on Si, Glass, SOI, and Cavity SOI substrates. These process modules expedite fabrication iterations for customer design validation and shorten the product time-to-market. APM continues to deepen and expand its process module categories and streamline their integration to meet customers' specific requirements.

Substrate Technology

• Cavity SOI / Layer Transfer Technology

• SOG (Silicon on Glass) / Structured Glass and Glass Wafer Process

• Trench Isolation Technology

• Thin Wafer Handling (~200um)

Process Technology

• DRIE Step Comb / Step Deep Etch

• Nano Tip Process

• Fine Pattern on 3D Structures

Wafer Level Bonding

• Fusion Bond (Si-Si, Si-SiO2, SiO2-SiO2)

• Anodic Bonding (Including SGS / GSG Sandwich Bonding) 

• Low Temperature Adhesive Bonding

• Eutectic Bonding for Hermetic Seal 

• Capping with Lateral Feed Through and Special Dicing (Pad Reveal)