MEMS Express: Process Platforms

Thermal Isolation Devices



  • Suitable for thermal isolation devices (Flow, Gas, Temperature, etc.)
  • Layout design comes from customer.
  • Fixed process (film stacking and thickness) but adjustable Pt thickness (≤ 2000A)
  • Reliable adhesion layer for Pt to base film & passivation
  • Proper film composition with stress balance
  • Suspended diaphragm for high-temperature operation (heater > 650°C)
  • Integration of Pt heater & RTD or thermopile temperature sensor
  • Small sensing area, less than 1.0 mm2






For further information, please feel free to contact us via the following email address.