Recently, Taiwan's Asia Pacific Microsystems Inc. (APM) reached an alliance agreement with UMC for 200mm MEMS wafer fab capacity. UMC is an investor in APM. As part of this agreement, UMC and APM will collaborate to support current and future customers for the 200mm MEMS process. UMC will provide the fab manufacturing, logistic management and required capacity expansion. APM will bring its MEMS process technologies.

Recently, Taiwan's Asia Pacific Microsystems Inc. (APM) reached an alliance agreement with UMC for 200mm MEMS wafer fab capacity. UMC is an investor in APM.

As part of this agreement, UMC and APM will collaborate to support current and future customers for the 200mm MEMS process. UMC will provide the fab manufacturing, logistic management and required capacity expansion. APM will bring its MEMS process technologies.

The joint APM-UMC MEMS team has been working together during the last 18 months for this development. A 200mm MEMS prototype line has been set up in one of UMC's fabs and will soon begin process qualification on one product.

(Detailed information please refer to EE Times Asia website.)